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香港科技大学香港科技大学Entry 9/2027MEngOpenChecked 10/23

工学硕士(设计智能)

Master of Engineering in Design Intelligence

Tuition
HK$400,000
≈ CNY 36.80k
This is the total fee for the whole program as published by the school, not a yearly fee.The CNY figure uses a rough rate of HK$1 ≈ ¥0.92, for orientation only. The rate on the day you pay applies.
Official · 10/23
Duration
2 years
IELTS
6.5(5.5)
Official · 10/23
CET-6
Not accepted
Next deadline
2026年12月1日
Round 1 ·

Application rounds

Checked 10/23

Where today (2026年10月31日) falls on the timeline

  1. Round 1

    All applicants

    Admissions is on rolling basis

  2. Round 2

    All applicants

    Admissions is on rolling basis

  3. Round 3

    All applicants

    Admissions is on rolling basis

Entry requirements

Program rule
IELTS (overall / sub-score)
6.5 / 5.5
TOEFL
TOEFL iBT 80 (tests taken prior to 21 January 2026) or 4.5 (tests taken from 21 January 2026 onwards); TOEFL pBT 550; TOEFL Revised Paper-delivered Test 60
CET-6
Not accepted项目页英语要求只列 TOEFL / IELTS,未列 CET-6;研究生院 FAQ:“You will need to take either TOEFL or IELTS (Academic Module)”(母语为英语或本科为英文授课者除外)

Programs also set degree, GPA and experience requirements; see the official page.

Program details

Faculty
Division of Integrative Systems and Design (Academy of Interdisciplinary Studies)
Study mode
Full-time
Duration
2 years
Program code
MEng(DI)
Language
Unverified
Fee (as published)
HK$400,000

Official sources

Checked on 2026年10月23日. Dates and fees can change; confirm on the official site.

Verification notes:2026/27 课程目录中没有此项目(2027/28 目录首次出现),但页面未明确标注“新开”,isNew 留空待人工确认

About 香港科技大学

香港科技大学

香港科技大学The Hong Kong University of Science and Technology

QS #44U.S. News #101

1991 年开校,香港第一所研究型大学。以科技和商业管理为主、人文社科并重,商科与工科尤为见长;2022 年获批设立香港科技大学(广州)。

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Program website